| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic assembly that includes an underfill adhesive between an electronic component and a substrate, wherein each structural member provides uniform linear expansion, and provides higher reliability that reduces the cause of thermal mechanical fatigue of the bonded part. <P>SOLUTION: The electronic assembly 10 includes an electronic component with an underfill adhesive 16 between itself and a substrate, wherein the electronic component is electrically connected to the substrate 14. The underfill adhesive 16 contains the reaction product of a curable underfill bonding composition that comprises a mixture of a polyepoxide resin, a curing catalyst, a fluxing agent, and surface-treated nanoparticles 18 that are substantially spherical, non-agglomerated, amorphous, and solid. The curable underfill bonding composition has a viscosity of 1,000 to 100,000 centipoise at 25°C. The surface-treated nanoparticles have a mean particle size of 5 to 600 nanometers. The method of fabricating the electronic assembly 10 is also disclosed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
