| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inverter apparatus of easy assembly and an improved rate in good article assembly. <P>SOLUTION: A positive side conductor 33, a negative side conductor 37, and an AC side conductor 35 are joined to the surface of a heatsink 22. A semiconductor element unit 10 includes a diode and IGBT joined between the positive side conductor 33 and the AC side conductor 35, a diode and IGBT joined between the negative side conductor 37 and the AC side conductor 35, a positive side electrode 39 provided to the positive side conductor 33, a negative side electrode 40 provided to the negative side conductor 37, and a first output electrode 41 and a second output electrode 42 provided to the AC side conductor 35. Further, a positive side terminal 50 is provided to the positive side electrode 33, and the negative side terminal 51 is provided to the negative side electrode 40. The first output electrode 41 and the second output electrode 42 are provided with a first output terminal 52 and a second output terminal 53 respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT |
