发明名称 PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for housing an optical semiconductor element efficiently transmitting an optical signal between the optical semiconductor element and the outside with a simple structure, and to provide an optical semiconductor device. <P>SOLUTION: The package for housing an optical semiconductor element includes: a container 10 including a bottom part 1 having a mounting part 1a for mounting the optical semiconductor element 6 thereon, and a wall part 2 arranged in an outer peripheral part of the bottom part 1 to surround the mounting part 1a; screwing parts 1c formed to project outward from the bottom part 1; a through-hole 2a formed to penetrate the wall part 2 outward and inward; and a translucent member 4 arranged to close the through-hole 2a. A part of the container 10 with the through-hole 2a formed therein is formed into a projecting part 1b formed so that the container 10 project outward, and the screwing parts 1c are formed in a part of the container 10 excluding the projecting part 1b. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010177427(A) 申请公布日期 2010.08.12
申请号 JP20090018112 申请日期 2009.01.29
申请人 KYOCERA CORP 发明人 TANAKA NOBUYUKI;KAWABATA KAZUHIRO
分类号 H01S5/022;H01L23/02;H01L23/04;H01L31/02 主分类号 H01S5/022
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