发明名称 DRESSING APPARATUS, DEVICE AND METHOD OF CHEMICAL MECHANICAL POLISHING
摘要 <P>PROBLEM TO BE SOLVED: To provide a dressing apparatus for dressing a polishing pad without generating too much uneven wear, and reducing dressing load. <P>SOLUTION: The dressing apparatus includes a dressing member 42 having a dressing face abutting to the polishing pad 10 to slide freely, a dresser drive shaft 32 rotatable and vertically movable, dresser flanges 41A, 41B coupled to the dresser drive shaft 32 and configured to secure the dressing member 42 thereto, a spherical bearing 45 provided in the dresser flanges 41A, 41B and configured to allow the dressing member 42 to tilt with respect to the dresser drive shaft 32, and a spring mechanism 49 configured to generate a force against tilting motion of the dressing member 42. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010172996(A) 申请公布日期 2010.08.12
申请号 JP20090016851 申请日期 2009.01.28
申请人 EBARA CORP 发明人 WATANABE KAZUHIDE;KOSUGE RYUICHI;ISOBE SOICHI
分类号 B24B53/12;B24B37/00;B24B45/00;B24B53/00;B24B53/017;B24B53/02;B24D7/16;H01L21/304 主分类号 B24B53/12
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