| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively provide a heat dissipation structure which is superior in thermal conductivity and has high heat dissipation performance. Ž<P>SOLUTION: The heat dissipation structure includes a substrate, a surface layer formed on both surfaces or one surface of the substrate and comprising Al or an Al alloy layer, and an aluminum carbide whisker layer growing outward from the surface layer, wherein a melting point of the surface layer is lower than the melting point of the substrate. It is preferable that a difference between these melting points is ≥50°C and the thermal conductivity of the substrate at 25°C is ≥150 W/mK. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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