| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive base material causing no bulge nor peeling even when fired, and a method for manufacturing it. Ž<P>SOLUTION: This metal nanoparticle paste includes: metal colloid particles (A) formed by metal nanoparticles (A1) and protective colloids (A2) covering the metal nanoparticles (A1); a dispersion medium (B) composed of a polar solvent whose boiling point is 100-250°C, and a dispersion auxiliary agent (C) composed of a hydrophilic compound whose boiling point or decomposition temperature exceeds 250°C and number average molecular weight is 200-2,000. The metal nanoparticle paste is prepared. When the metal nanoparticle paste is used, a sintered film firmly adhering to a base material (especially a transparent electrode film composed of a metal oxide such as ITO and FTO) is formed without causing bulge even when fired. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
