发明名称 APPLICATION METHOD AND PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an application method for filling a space between banks formed on a substrate by inkjet application with a coating film with high accuracy. SOLUTION: The coating film 7 is formed in a region 3 surrounded by the bank 2 on a substrate 1 so as to form a gap in the region 3 surrounded by the banks 2 by inkjet system. The coating film 7 is softened to be fluidized so that the gap formed in the region 3 surrounded by the banks 2 is filled with the coating film 7, and the region 3 surrounded by the bank 2 is filled with the coating film 7. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010176138(A) 申请公布日期 2010.08.12
申请号 JP20100041631 申请日期 2010.02.26
申请人 TOKYO ELECTRON LTD 发明人 TANAKA YUKINOBU
分类号 G02B5/20;B05D1/26;H01L51/50;H05B33/10;H05B33/12;H05B33/22 主分类号 G02B5/20
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