发明名称 |
BONDING METHOD, BONDED BODY, DROPLET EJECTION HEAD, AND DROPLET EJECTION APPARATUS |
摘要 |
A bonding method of manufacturing a bonded body is provided. The bonding method comprises: after providing a first object in which a plasma polymerization film having a surface is formed on a base member, applying an energy to the surface of the plasma polymerization film to activate the surface; after providing a second object having a surface to be bonded to the surface of the plasma polymerization film of the first object and no plasma polymerization film onto the surface of the second object, bonding the surface of the second object and the surface of the activated plasma polymerization film so that the surface of the plasma polymerization film is bonded to the surface of the second object to obtain the bonded body.
|
申请公布号 |
US2010200144(A1) |
申请公布日期 |
2010.08.12 |
申请号 |
US20080665259 |
申请日期 |
2008.06.16 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
MATSUO YASUHIDE |
分类号 |
B32B37/12;B32B9/00;B41J2/015 |
主分类号 |
B32B37/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|