发明名称 APPARATUS FOR CONTROLLING MULTI ELECTRODE AND PLASMA PROCESSING SYSTEM
摘要 PURPOSE: An apparatus for controlling a multi-electrode and a plasma processing system are provided to adjust the distribution ratio of power, applied to each electrode, by detecting the change of impedance of each electrode. CONSTITUTION: A plurality of electrodes(110a, 110b, 110c, 110d, 110e, 110f) is prepared in a chamber. A radio-frequency(RF) generator(330) supplies RF power to the electrodes. A plurality of power controlling units(350a, 350b, 350c, 350d, 350e, 350f) is respectively connected with the electrodes to obtain constant power. A matching unit(320) is connected between the power controlling unit and the RF generator. The matching unit performs an impedance matching operation between the RF generator and the electrodes.
申请公布号 KR20100089642(A) 申请公布日期 2010.08.12
申请号 KR20090008982 申请日期 2009.02.04
申请人 SEMES CO., LTD. 发明人 PARK, KEUN YOUNG;CHO, JUNG KEUN;KOO, KYO WOOG
分类号 H05H1/30;H01L21/3065;H05H1/34;H05H1/36 主分类号 H05H1/30
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