发明名称 RESIN COMPOSITE LEAD FRAME, MANUFACTURING METHOD THEREOF, AND PACKAGE THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To resolve the problem that using a single resin layer in a resin portion of a resin composite lead frame for optical devices makes it impossible to achieve both maintainability of a reflection coefficient against aging and stiffness and strength required for a package. <P>SOLUTION: When a silicone resin 3 is used for a resin layer on the outermost surface and an epoxy resin 2 is used for one of resins of lower layers, a resin composite lead frame for LED can be obtained which has high maintainability of a high reflection coefficient against aging, high stiffness and high strength, because of a high light transmissive property and a high photo-degradation resistance of the silicone resin and a high-stiffness and high-strength property of the epoxy resin. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010177329(A) 申请公布日期 2010.08.12
申请号 JP20090016417 申请日期 2009.01.28
申请人 SHARP CORP 发明人 KOBAYASHI SHINJI
分类号 H01L23/50;H01L23/48;H01L33/48 主分类号 H01L23/50
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