SEMICONDUCTOR PACKAGE BODY, PACKAGE FOR SEMICONDUCTOR APPARATUS, SEMICONDUCTOR APPARATUS, AND MICROPHONE PACKAGE

摘要

PROBLEM TO BE SOLVED: To improve the strength of a bottom plate without impairing miniaturization in a premolded type package and enhance reliability of mounting.

SOLUTION: Internal connection surfaces 41 to 43 and an external connection surface for each terminal part are respectively exposed to upper and lower surfaces of a bottom plate 52 of a box mold resin body 6, and a conductive frame 25 is exposed to an upper end surface of a peripheral wall 53. On the upper surface of the bottom plate 52, rising walls 54 to 56 separating semiconductor chip mounting regions X and Y from the internal connection surfaces 41 to 43 for each terminal part are formed so as to protrude from the surface of the semiconductor chip mounting regions X and Y. Thick resin parts 58 and 59 connecting the rising walls 54 and 55 with the peripheral wall 53 are formed at a position other than the internal connection surfaces 42 and 43 on the opposite side of the semiconductor chip mounting regions X and Y via the rising walls 54 to 56.

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