| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of producing a semiconductor device high in connection reliability, and never causing void occurrence failure or a connection failure due to resin curing. <P>SOLUTION: In this method for mounting a semiconductor element 4 having metal projections 2 on electrode pads 3 on a circuit board 6 having wiring patterns 5 corresponding to the electrode pads 3, the electrode pads 3 on the semiconductor element 4 are positioned with respect to the wiring patterns 5 on the circuit board 6; this cold-plastic adhesive material 7 is interposed between the electrode pads 3 and the wiring patterns 5; the semiconductor element 4 is pressed against the circuit board 6 to press and expand the cold-plastic adhesive material 7; the metal projections 2 is brought into contact with the wiring patterns 5 and electrically connected to each other by press contact or eutectic bonding formation; and thereafter the cold-plastic adhesive material 7 is solidified by heating to fix the semiconductor element 4 to the circuit board 6. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
