| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor relay module having a new structure which can improve the efficiency of a cabling space and can flexibly cope with even a change of the specification of a connector. Ž<P>SOLUTION: Both an S-connection terminal 18 connected to a source electrode and a D-connection terminal 20 connected to a drain electrode are projectively formed on a mounting surface to a printed circuit board 12 in a module body 16 while a G-connection terminal 22 connected to a gate electrode is projectively formed on a surface 38 different from the mounting surface of the module body 16. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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