| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic electronic component capable of surely forming a via conductor in the successful shape since a through hole with high perpendicularity and high taper ratio can be formed. SOLUTION: In the method for manufacturing the multilayer ceramic electronic component 101, the through hole 130 is formed on a laminate 220 by a laser machining process. In the process, a system for controlling an irradiating position via an optical system 303 on which a laser beam 250 is reflected and converged is adopted. The maximum width of a machining area which can be controlled via the optical system 303 is set to ≤50 mm. Focal distance of the laser beam 250 is set to ≥70 mm, focal depth of the laser beam 250 is set to ≥70 μm, and wavelength of the laser beam 250 is set to ≥2 μm and ≤20 μm. As an irradiation system of the laser beam 250, a pulse system is used, and pulse width is set to ≥15μsec and ≤150μsec. When the laser beam is irradiated at a specific hole forming position P1 for n times, irradiation for n times is not continuously performed to specific hole forming positions P2-P5. COPYRIGHT: (C)2010,JPO&INPIT
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