| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive structure adhered by an adhesive agent adhering with a high frequency wave dielectric internal heating system. SOLUTION: The adhesive structures includes as follows: the adhesive agent can cure in the high frequency dielectric heating carried out under the impression of the high frequency wave of the frequency of 28 MHz or 40 MHz, and is an epoxy adhesive agent which at least includes a base resin consisting of an epoxy resin, a latent curing agent, and a high frequency wave absorbency filler material which can generate heat by the impression of the high frequency wave of the frequency of 28 MHz or 40 MHz, and while the adhesive agent is cured by heating, the adhering interface of the adhesive agent and a first adherend including a thermoplastic material is melted by heating. COPYRIGHT: (C)2010,JPO&INPIT
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