| 摘要 |
A crack (17a) is generated from a modification region (7a) to the front surface (12a) of a workpiece (1) and a crack (17b) is generated from a modification region (7b) to the back surface (12b) of the workpiece (1) with an intervening unmodified region (2). The continuous progression of cracking in the thickness direction of the silicon substrate (12) when multiple lines of modification regions (7) are formed can thereby be prevented. Moreover, by generating stress in the workpiece (1), the crack (17a) and the crack (17b) are connected in the unmodified region (2) and the workpiece (1) is cut. The snaking, etc., of cracks in the back surface (12b) of the workpiece (1) is thereby prevented and the workpiece (1) can be cut along the planned cutting line (5) with good precision. |
