| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a semiconductor element flip-chip mounted thereon, which allows the amount of warpage to be controlled by the number, heights, and widths of recessed portions and allows the warpage to be reduced while being protected a semiconductor element, and a method of manufacturing the same. <P>SOLUTION: In the semiconductor device, a semiconductor element 2 having a projecting electrode 3 formed thereon is flip-chip connected with a circuit board 4 via the projecting electrode 3, a space between the semiconductor element 2 and the circuit board 4 is sealed with a first resin 5, and a first surface on which the semiconductor element 2 is mounted, of the circuit board 4 is covered with a second resin 6 different from the first resin 5 together with the semiconductor element 2, and a recessed portion 7 is formed in a part covered with the second resin 6 on at least a part of a rear surface of the semiconductor element 2. <P>COPYRIGHT: (C)2010,JPO&INPIT |
