发明名称 POLYAMIDE RESIN COMPOSITION, POLYAMIDE RESIN FILM, AND METHOD FOR MANUFACTURING POLYAMIDE RESIN FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide resin film having excellent transparency and oxygen barrier properties upon high humidity condition, to provide a polyamide resin composition suitable for manufacture of the same and to provide a method for manufacturing the same. Ž<P>SOLUTION: The polyamide resin composition is formed by compounding the following components (A) to (D). The components are (A) 40 to 95 pts.wt. nylon 6 resin having sulfuric acid relative viscosity of 3.0 to 5.0, (B) 50 to 60 pts.wt. nylon 6I/6T copolymer resin having sulfuric acid relative viscosity of 1.8 to 2.4 and 50 to 80 wt.% copolymerization composition of a 6I component, (C) 0.01 to 3 pts.wt. bisamide compound to 100 pts.wt. sum total of (A) and (B), and (D) 0.005 to 1.0 pts.wt. polyethylene glycol-based compound having molecular weight of 5,000 or below to 100 pts.wt. sum total of (A) and (B). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010174158(A) 申请公布日期 2010.08.12
申请号 JP20090019255 申请日期 2009.01.30
申请人 TORAY IND INC 发明人 YOGO HIDEO;TACHIBANA YASUHITO
分类号 C08L77/02;C08J5/18;C08K5/20;C08L71/02;C08L77/06 主分类号 C08L77/02
代理机构 代理人
主权项
地址