THERMOSETTING RESIN, THERMOSETTING COMPOSITION CONTAINING THE SAME, AND MOLDED ARTICLE AND CURED ARTICLE OBTAINED FROM THE SAME

摘要

<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin having both excellent dielectric constant and heat resistance; a thermosetting composition containing the same; and a cured article and a molded article obtained from the same. Ž<P>SOLUTION: The thermosetting resin includes a dihydrobenzoxazine ring structure of the general formula (I). In the general formula (I), each R1-R8 represents a group selected from the group consisting of 1-10C organic groups. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž