| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method and an expanding apparatus by which a wafer is divided precisely into individual chips collectively regardless of a type of the wafer, and a manufacturing yield is improved. SOLUTION: In an expanding process in the dicing method, a peripheral part of an adhesive resin tape 30 is fixed onto a table 41, and a ring stage 43 and a pressing stage 44 which are disposed inside the table 41 and hold a wafer ring 42, are raised relatively to a virtual plane including a surface to which the adhesive resin tape 30 is fixed, of the table 41 so as to perform a stretching step of stretching the adhesive resin tape 30 over the wafer ring 42. A dividing step is then performed wherein the pressing stage 44 is raised to expand the adhesive resin tape 30 and a bending stress is applied to a wafer 10 to divide the wafer into individual chips 1, and then, a restretching step is performed wherein the ring stage 43 is furthermore raised relatively to the virtual plane to stretch again the adhesive resin tape 30 over the wafer ring 42. COPYRIGHT: (C)2010,JPO&INPIT
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