| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing the multilayer capacitor. <P>SOLUTION: Even when an electrostrictive vibration is generated in the multilayer capacitor 1 upon voltage application, a joint surface 13 of a metal terminal 5 can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface 13 is formed with a cutout 18 and thus can fully secure its flexibility. Further, in the multilayer capacitor 1, a step 16 formed by a terminal connecting surface 11, a substrate connecting surface 12, and the joint surface 13 is positioned within an area overlapping an element body 3 as seen in the laminating direction of dielectric layers 2. Therefore, solder fillets 17 do not protrude out of the element body 3, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets 17 is easy to see from the outside, and a connection yield can also be secured. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
