| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate the need for adhesive and then uniform the mounting height of electronic parts to be arranged. <P>SOLUTION: A multi-layer board incorporating electronic component includes: a core formed with a plurality of holes for containing an electronic part, a bottom insulating resin layer formed on the bottom surface of the core, a top insulating resin layer formed on the top surface of the core, a wiring layer selectively formed on the outer surface of the bottom insulating resin layer or top insulating resin layer, and an electronic part contained in any of the holes. Both of the bottom and top insulating resin layers have a structure that is a combination of a resin which is changed to cohesiveness when heated and which undergoes smaller plastic deformation when heated to a higher temperature and an insulating resin layer which has a thickness sufficient to maintain insulation between the electronic part or a conductor of the core and the wiring layer and which inherently undergoes small plastic deformation. Thus, the electronic part is securely bonded and sealed in the hole without using an adhesive separately. <P>COPYRIGHT: (C)2010,JPO&INPIT |
