| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface treatment device which is capable of locally planarizing a thinned substrate and can be miniaturized and simplified. <P>SOLUTION: The surface treatment device includes a nozzle 3 having a jet outlet 33a for injecting a treatment liquid for etching and an intake 34a for sucking the treatment liquid injected from the jet outlet 33a. <P>COPYRIGHT: (C)2010,JPO&INPIT |
