| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board for surely preventing solder bridges and solder chips and also preventing defective soldering work, particularly even when a narrow pitch is provided between leads in soldering the double-lead type electronic component by the jet type soldering method. <P>SOLUTION: In the printed circuit board 1, soldering lands are arranged for connection of each lead of the double-lead type electronic component 2 by the jet type soldering method and a soldering land 4 is provided for adhesion of excessive solder during the soldering process at the rear part of the last soldering land 3h in the progressing direction of the jet type soldering method. The soldering land 4 is formed to have a square external shape and includes a slit 4a formed in the shape being bent internally. One corner of the square shape is arranged between the leads near the last soldering land 3h and the bending part of the slit is arranged near the corner. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
