发明名称 ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic component capable of improving isolation characteristics. SOLUTION: Leak of electromagnetic waves from the side of a transmitting filter to the side of a receiving filter is reduced to improve the isolation characteristics by forming a wall part 6 which is made of metal and separated from a package substrate 1 between a transmission filter chip 3 and a reception filter chip 2. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010177559(A) 申请公布日期 2010.08.12
申请号 JP20090020356 申请日期 2009.01.30
申请人 TAIYO YUDEN CO LTD 发明人 INOUE KAZUNORI;MATSUDA TAKASHI
分类号 H01L25/04;H01L23/00;H01L25/18;H03H3/08;H03H9/25 主分类号 H01L25/04
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