发明名称 |
ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component capable of improving isolation characteristics. SOLUTION: Leak of electromagnetic waves from the side of a transmitting filter to the side of a receiving filter is reduced to improve the isolation characteristics by forming a wall part 6 which is made of metal and separated from a package substrate 1 between a transmission filter chip 3 and a reception filter chip 2. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010177559(A) |
申请公布日期 |
2010.08.12 |
申请号 |
JP20090020356 |
申请日期 |
2009.01.30 |
申请人 |
TAIYO YUDEN CO LTD |
发明人 |
INOUE KAZUNORI;MATSUDA TAKASHI |
分类号 |
H01L25/04;H01L23/00;H01L25/18;H03H3/08;H03H9/25 |
主分类号 |
H01L25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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