| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device without necessity to connect a first circuit arranged on one surface of a substrate to a second circuit arranged on the other surface of the substrate by external wiring. SOLUTION: The first circuit 20 including semiconductor elements 22, 23 is arranged on one surface of the substrate 10. The second circuit 30 having the semiconductor elements 32, 33 and to be connected to the first circuit 20 is arranged on the other surface of the substrate 10. The first circuit 20 is connected to the second circuit 30 by a plate-like conductive connection member 41. COPYRIGHT: (C)2010,JPO&INPIT |
