| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape having an adhesive layer and an adhesive film on a release film, which enables sufficient suppression of transfer marks left on the adhesive layer when being taken up into a roll. SOLUTION: The wafer processing tape includes: an adhesive layer 12 provided on the release film 11; the adhesive film 13 having a label portion 13a covering the adhesive layer and provided so as to come into contact with the release film in the periphery of the adhesive layer, and a peripheral portion 13b provided so as to surround the outside of the label portion 13a; and a groove which is formed so as to be inclined with respect to the release film such that an angle formed by a label portion surface and a label portion-side edge part becomes obtuse, and so as to have an angle of 0.2°to 84°with respect to the release film, at the outer periphery part of the label portion on the outside of the adhesive layer. COPYRIGHT: (C)2010,JPO&INPIT
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