| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of surely preventing a bridge of an adjacent electrode (such as a solder bump) of a semiconductor chip, and stabilizing the height of the connection (mounting) of the semiconductor chip on a substrate regarding the technology for connecting the semiconductor chip with the substrate. SOLUTION: In the semiconductor manufacturing device (thermocompression bonding device 1) which performs a connection process between the semiconductor chip and the substrate, one or more projections 5 are formed at parts except an area for holding the rear surface of the semiconductor chip 21 on a plane (d) of a heating tool 3 which holds the semiconductor chip 21 to perform heating pressurization. The connection (mounting) height of the semiconductor chip 21 on the substrate 23 is controlled by descending the heating tool 3 which holds the semiconductor chip 21 to the substrate 23 on a stage 2, and making the projections 5 contact with the substrate 23, and an electrode (solder bump 22) of the semiconductor chip 21 is connected to an electrode 25 of the substrate 23 by performing the heating pressurization. COPYRIGHT: (C)2010,JPO&INPIT |
