Design Methods for E-Beam Direct Write Lithography

摘要

A method of forming integrated circuits for a wafer includes providing an E-Beam direct write (EBDW) system. A grid is generated for the wafer, wherein the grid includes grid lines. An integrated circuit is laid out for the wafer, wherein substantially no sensitive features in the integrated circuit cross the grid lines of the grid. An EBDW is performed on the wafer using the EBDW system.