An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
申请公布号
CA2704683(A1)
申请公布日期
2010.08.12
申请号
CA20102704683
申请日期
2010.05.28
申请人
IBM CANADA LIMITED - IBM CANADA LIMITEE
发明人
BLANDER, ALEXANDRE;BEAUMIER, MARTIN;GAGNON, PASCALE;GAYNES, MICHAEL A.;GIGUERE, ERIC;SALVAS, ERIC;TOUSIGNANT, LUC