PURPOSE: A PCB(Printed Circuit Board) via forming method is provided to improve the bonding force between a via and a land by plating the inside of the via hole with conductive material to form the via. CONSTITUTION: A reference hole(103) passing through a part of the insulating layer(101) laminated with a copper foil(102) is formed. The copper foil on one side of the insulating layer on the outside of the reference hole is removed. A first window of a plurality of spaced dots shape and a second window(104b) of ring shape are formed. A via hole is formed by removing the insulation layer and the copper foil which are exposed by the first window.
