| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress production of migration and whiskers by preventing occurrence of abnormalities by a conductive foreign matter mixed in a gap space part between a semiconductor package and a wiring substrate and performing rust-proofing of the gap space part. <P>SOLUTION: The semiconductor package 10A having a semiconductor device 12 connected to outer peripheral electrode 15a of an interposer 11A faces a wiring substrate 21A across a gap G, and is joined to the outer peripheral land 24a of the wiring substrate 21A by soldering to constitute an electronic substrate 20A. A moisture-proof coating material 40 by soft silicon resin is applied to the surface part 41, the surrounding part 42, the gap space part 43 of the semiconductor package 10A, and the rear part 44 of the wiring substrate 21A, and a plurality of through holes 22 provided to the wiring substrate 21A communicate with the gap space part 43. The electronic substrate 20A is immersed in moisture-proof solution 51 with which a diluent material is mixed, the moisture-proof solution 51 flows in from the outer periphery of the gap space part 43 and the through hole 22, and film coating is performed by heating and drying. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
