| 摘要 |
PURPOSE: A semiconductor device is provided to increase reliability by easily bonding a warpage prevent member with a heat sink through brazing. CONSTITUTION: An insulating substrate(10) comprises a ceramic substrate(11) and a metal coating layer(12) on both sides of the ceramic substrate. A semiconductor chip(20) is loaded on the insulating substrate. A heat sink(30) is fixed to the insulating substrate and is connected to the semiconductor chip through the insulating substrate. |
