SILVER-CONTAINING ALLOY PLATING BATH AND METHOD FOR ELECTROLYTIC PLATING USING SAME

摘要

Disclosed is a silver-containing alloy plating bath which can provide a silver-containing alloy plated product having excellent oxidation resistance and suitable for electronic members, decorative members and dental members. Also disclosed is an electrolytic plating method using the silver-containing alloy plating bath. Specifically, the plating bath is used for depositing a silver-containing alloy on the surface of a base, and contains (a) a silver compound containing 99.9-46% by mass of silver base on the total mass of the metals contained in the plating bath, (b) a gadolinium compound containing 0.1-54% by mass of gadolinium base on the total mass of the metals contained in the plating bath, (c) at least one complexing agent and (d) a solvent. The electrolytic plating method uses this plating bath. A silver-containing alloy plated product having excellent oxidation resistance can be obtained by the plating bath and the electrolytic plating method.