发明名称 SOURCE AND MASK OPTIMIZATION
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for optimizing an illumination source and mask features for microlithography. <P>SOLUTION: The illumination source is optimized by changing the intensity and shape of the illumination source to form an image in the image plane that maximizes the minimum ILS (Image Log Slope) at user selected fragmentation points while forcing the intensity at the fragmentation points to be within a small intensity range. An optimum mask may be determined by changing the magnitude and phase of the diffraction orders to form an image in the image plane that maximizes the minimum ILS at user selected fragmentation points while forcing the intensity at the fragmentation points to be within a small intensity range. The optimum mask may be used to create a CPL (Chromeless Phase Lithography) mask by assigning areas of minimum transmission in an optimum transmission mask to a -1, and areas of maximum transmission to a +1. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010176144(A) 申请公布日期 2010.08.12
申请号 JP20100068656 申请日期 2010.03.24
申请人 ASML MASKTOOLS BV 发明人 SOCHA ROBERT JOHN
分类号 G03F1/08;G03F7/20;H01L21/027 主分类号 G03F1/08
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