| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED board device for an LED printhead without degrading flatness (distorting, warping, bending) of a board due to repetition of heating/cooling in a manufacturing process. <P>SOLUTION: In this LED board device 5 including a long bare board 9 having a flat pattern formed on the front surface and having wiring patterns (161-167) of the same width formed on the back surface 11, and LED array chips fixed on the flat pattern in a linear or zigzag form, the wiring patterns (161-167) are divided into three or more groups, and arranged at equal intervals in the short-side direction of the bare board 9 in each group; extension patterns 21 are formed along the long-side direction of the bare board 9 in parts without having wiring pattern of an area 18 on the back surface corresponding to the flat patterns formed on the front surface; the width of the extension patterns 21 is identical to that of the wiring patterns (161-167); and the extension patterns 21 are formed at the same intervals as those of the wiring patterns in the short-side direction of the bare board 9. <P>COPYRIGHT: (C)2010,JPO&INPIT |
