| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chucking apparatus and a chucking method for a wafer, which can prevent occurrence of lifting and displacement of the wafer when conduction is secured from the back of the wafer and reduce a residual electric charge as much as possible when the wafer is removed from a chuck. <P>SOLUTION: The chucking apparatus includes: a first and a second electrodes 4 and 6; an insulator part 8 on which the back of the wafer is placed; an electrostatic chuck part 2 having a through hole passing through from the back to the principal plane of the insulator part; a conduction needle 20 which can be passed through the through hole; a conduction needle drive device 24 for driving the conduction needle so as to move it in the through hole from the back to the principal plane of the insulator part to thrust another end of the conduction needle onto the back of the wafer; and a voltage controller 10 which can provide a voltage different in polarity and the same in polarity to the first and the second electrodes, and also make a value of voltage to be provided to the first and the second electrodes variable. <P>COPYRIGHT: (C)2010,JPO&INPIT |
