| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such the problem that there is a probability that durability of a through hole substrate is reduced due to application of large stress to the through hole substrate when dissipating much heat via a metal filled in a through hole, since a coefficient of thermal expansion of the metal is higher than that of the through hole substrate. <P>SOLUTION: A light-emitting device includes: an insulating member having a main surface, a rear surface, and a through hole penetrating the member from the main surface to the rear surface; a conductor layer disposed on the main surface of the insulating member; a conductive member disposed in the through hole and electrically insulated from the conductor layer; and a light-emitting element disposed on the main surface of the insulating member so as to be electrically connected to the conductor layer and the conductive member. The cross-section of the conductive member perpendicular to the main surface has such a shape that a width in a direction parallel to the main surface, of the conductive member is wider in a rear surface-side end part than in a main surface-side end part. <P>COPYRIGHT: (C)2010,JPO&INPIT |
