| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a backlight device with heat dissipation efficiency improved by adhering a driving substrate to a chassis by using the fact that a driving voltage is lowered by partial driving control, and which facilitates electrically connecting a light source substrate mounting LEDs with a driving substrate for driving the LEDs with a connecting pin. <P>SOLUTION: The backlight unit includes an LED light source substrate structured of a chassis with a flat-shape plane part, a heat dissipation surface adhered to a first surface of the plane part, and an element-forming surface mounting a plurality of LEDs, an LED driving substrate adhered to a second surface contrary to the first surface of the plane part and mounting a control circuit for driving the LEDs, and at least one connecting structure constituted by including metallic connecting pins for electrically connecting the LED light source substrate and the LED driving substrate by pinching the LED light source substrate, the plane part of the chassis and the LED driving substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
