| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel method and a novel apparatus for forming bump electrodes capable of forming a plurality of bump electrodes in remarkably close proximity to each other, when bump electrodes having a comparatively large volume are formed with small pitches in an electronic component. Ž<P>SOLUTION: The method for forming bump electrodes is a method for forming a plurality of bump electrodes on a surface of the electronic component. The method comprises a mounting step of mounting a columnar metallic piece, which has a nearly same volume as a desired bump electrode, are formed such that the maximum dimension of a cross section perpendicular to an axial center is less than that of the desired bump electrode, and are mainly formed of a low-melting-point metal, on the electronic component via a through-hole of a mounting jig such that an edge surface of the metallic piece abuts on one surface of the electronic component, and a reflow step of melting, cooling, and solidifying the metallic piece after the mounting step. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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