| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent dust generation associated with an opening operation of a closing valve in changing over the internal pressure of a chamber changeable over to an atmospheric atmosphere or a vacuum atmosphere, or dew condensation associated with heat-insulation expansion in closing valve communication. Ž<P>SOLUTION: In this vacuum treatment device including a lock chamber 3 for carrying a wafer in/from a vacuum treatment chamber 1, and a control means for controlling transport for carrying a wafer in a cassette into the vacuum treatment chamber through an atmosphere loader 5, the lock chamber and a vacuum transport chamber 7 and for carrying the processed wafer vacuum-treated in the treatment chamber therefrom, when the pressure in the lock chamber is changed over to the atmospheric pressure, the transport control means opens a closing valve of an inert gas supply line 11 once to set the pressure in the lock chamber at a predetermined value set by a pressure gage, thereafter determines whether dew condensation occurs in the lock chamber in opening an atmosphere communication line 18, and limits the flow rate of the atmosphere supplied through the atmosphere communication line by a flow control means inserted in the atmosphere communication line when the dew condensation is determined to occur. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
