发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion. |
申请公布号 |
US2010200969(A1) |
申请公布日期 |
2010.08.12 |
申请号 |
US20100686979 |
申请日期 |
2010.01.13 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
HUANG WEN PIN;HSU CHENG TSUNG;TSENG CHENG LAN;HUNG CHIH CHENG;CHEN YU CHI |
分类号 |
H01L23/48;H01L21/50;H01L23/495 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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