CIRCUIT BOARD STRUCTURE

摘要

A circuit board structure produced in a manner that reduces the amount of bubbles in solder at leadless connections between the circuit board and a land grid array or other electronic component, and improves the reliability of the connections. Component electrodes (11) of the land grid array are arranged in a matrix, and circuit board electrodes (2) of the circuit board are also arranged in a matrix. The circuit board electrodes (2) are tilted by exactly an angle f with respect to the component electrodes (11) which are shown by the dotted lines. When P1 is the point at which a side of the component electrodes (11) and a side of the circuit board electrodes (2) intersect, the cross-sectional shape of the molten solder at point P1 becomes concave to the outer side, so a structure is formed where large bubbles inside the molten solder are easily removed. As the amount of large bubbles in the solder are reduced, the reliability of solder without leads can be improved.