| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small-sized semiconductor package with an input/output terminal which is capable of reducing impedance mismatching which occurs when packaging the semiconductor package in a mounting substrate, and to provide a packaging method thereof. <P>SOLUTION: With respect to an input/output terminal 100 provided in the semiconductor package, signal line leads 8 and ground line leads 9 have wide portions 8A and 9A wherein lead widths are wider than those in both end of the signal line leads 8 and the ground line leads 9, outside signal lines 6 and ground lines 7 of the input/output terminal 100. The wide portions 8A and 9A are designed so that characteristic impedance may be about 50 Ω. This configuration of the signal line leads 8 and ground line leads 9 allows reduction in impedance mismatching which occurs when packaging the semiconductor package in a mounting substrate. Additionally, the semiconductor package can be miniaturized in the case of necessity of a plurality of input/output terminals because a lead structure is employed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
