| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic circuit module in which a shield structure is devised. <P>SOLUTION: The electronic circuit module includes a plurality of electronic parts mounted on a substrate, the space separating the electronic parts being filled with thermosetting insulating resin, the insulating resin being covered by metal foil along the profiles and the heights of the electronic parts, the outer periphery of the metal foil being electrically connected to a grounding electrode arranged on the substrate by means of a conductive material. <P>COPYRIGHT: (C)2010,JPO&INPIT |
