| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent cracks of a piezoelectric layer from generating when bonding, and make a distance between an oscillating board and a wiring member opposed each other constant. <P>SOLUTION: The oscillating board 30 is formed with a plurality of protruded parts 61, and the piezoelectric layer 31 is formed on the top face of the oscillating board 30. Heat treatment is applied to the piezoelectric layer 31 by heating the oscillating board 30 and the piezoelectric layer 31. The oscillating board 30 and four plates 10-13 are overlapped in layers, and each plate betweenness is bonded with adhesive while pressing the protruded parts 61 toward the four plates 10-13. A plurality of individual electrodes 32 are formed respectively on the piezoelectric layer 31, and bumps 62 are formed on terminal parts 35 of a plurality of the individual electrodes 32. A land 53 is formed on a substrate 51, the land 53 and the bumps 62 are positioned so as to face each other in planar view, an FPC 50 is pressed toward the piezoelectric layer 31 from a side opposite to the piezoelectric layer 31 until the protruded parts 61 contact the surface of the substrate 51 to electrically connect the bumps 62 with the land 53 by contact, and the FPC 50 is bonded to the piezoelectric layer 31. <P>COPYRIGHT: (C)2010,JPO&INPIT |
