| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem that failure in suction to a mounting component surface by a mounter head can not be securely detected without using an optical sensor and image recognition in combination in addition to a suction failure detecting method using a pressure value (vacuum pressure) by a pressure sensor which measures the vacuum pressure of the mounter head at electronic component suction by a chip mounter. <P>SOLUTION: In the chip mounter which sucks and holds the mounting component from a mounting component supply device by a mounter head unit, the mounter head unit incorporates the mounter head and an ultrasonic probe, and further includes a defective suction head detecting means connected to a nozzle and configured to irradiate the mounting component with an ultrasonic signal from the ultrasonic probe when the mounting component is sucked by the nozzle, to convert a reflected wave from the ultrasonic probe into an electric signal by the ultrasonic probe, and to compare it with an electric signal of normal suction stored in a memory in the chip mounter. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
