发明名称 HEMISPHERICAL SURFACE MOLDING DEVICE AND MOLDING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a hemispherical surface molding device capable of more easily molding tips of a variety of workpieces (for example grindstone) with different diameters into a hemispherical surface at a wider angle range and with higher accuracy, and also to provide a molding tool. SOLUTION: A grinding rotating surface is formed so as to become a conical inner surface by turning a grinding surface TM which flat and retained to have a predetermined angle Tθsmaller than 90°to a tool rotating axis TZ around the tool rotating axis TZ. The rotating axis WZ of the workpiece is set in a face including the tool rotating axis TZ, and set to be orthogonal with respect to the grinding rotating surface. At least one of the molding tool T rotating around the tool rotating axis TZ and the workpiece W rotating around the rotating axis WZ of the workpiece is moved in a mutually approaching direction. The tip of the workpiece W and the side surface of the workpiece W at the circumference of the tip are made to contact with the grinding rotating surface, and the circumference of the tip of the workpiece W is formed into a hemispherical surface shape. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010172974(A) 申请公布日期 2010.08.12
申请号 JP20090015329 申请日期 2009.01.27
申请人 JTEKT CORP 发明人 HIRANO MINORU
分类号 B24B53/06 主分类号 B24B53/06
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