| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board that facilitates measuring the arrangement and thickness of insulating layers, without changing such electrical characteristicss of the insulating layers as insulating properties and dielectric properties, and without inspecting the cross section by cutting the wiring board. SOLUTION: The multilayer wiring board includes an insulating substrate 11 composed of a lamination of insulating layers 11a, 11b, 11c, and 11d each made of an alumina sintered compact mainly made of Al<SB>2</SB>O<SB>3</SB>and containing Si, Mn, Mg, and Mo that is a colored component, wiring layers 12 and 13 formed on the surface and interior of the insulating substrate 11, and a through-conductor 14 which is formed inside the insulating substrate 11 and is connected to the wiring layers 12 and 13. The insulating layers 11a, 11b, 11c, and 11d each contain almost the same amount of the colored component of Mo at 0.4 to 0.6 wt.%, and have a color difference between insulating layers adjacent to each other in the direction of lamination, the color difference being 3 to 8 according to the L<SP>*</SP>a<SP>*</SP>b<SP>*</SP>color system under the JIS-Z-8730 standard. COPYRIGHT: (C)2010,JPO&INPIT |
