| 摘要 |
It is intended to provide a CMOS image sensor with a high degree of pixel integration. A solid-state imaging device comprises a signal line (256) formed on a Si substrate, an island-shaped semiconductor formed on the signal line, and a pixel selection line (255). The island-shaped semiconductor includes: a first semiconductor layer (252) connected to the signal line; a second semiconductor layer (251) located above and adjacent to the first semiconductor layer; a gate (253) connected to the second semiconductor layer through an insulating film; and a charge storage section comprised of a third semiconductor layer (254) connected to the second semiconductor layer and adapted, in response to receiving light, to undergo a change in amount of electric charges therein; a fourth semiconductor layer (250) located above and adjacent to the second and third semiconductor layers. The pixel selection line (255) is connected to the fourth semiconductor layer formed as a top portion of the island-shaped semiconductor.
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